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HSDL-3602 irda? data 1.4 compliant 4 mb/s 3v infrared transceiver data sheet description thefHSDL-3602fisfaflowfproflefinfraredftransceiverfmod - ulefthatfprovidesfinterfacefbetweenflogicfandfirfsignalsf forfthrough-air,fserial,fhalf-duplexfirfdataflink.fthefmod - ulef isf compliantf tof irdaf dataf physicalf layerf specifca - tionsf1.4fandfiec825-classf1feyefsafetyfstandard. thef HSDL-3602f containsf af high-speedf andf high-ef - ciencyf870 f nmfled,fafsiliconfpinfdiode,fandfanfintegrat - edfcircuit.ftheficfcontainsfanfledfdriverfandfafreceiverf providingf af singlef outputf (rxd)f forf allf dataf ratesf sup - ported.f applications ?f digitalfimaging f fdigitalfstillfcameras f fphoto-imagingfprinters ?f datafcommunication f fnotebookfcomputers f fdesktopfpcs f fwinfcefhandheldfproducts f f personalfdigitalfassistantsf(pdas) f f printers f f faxfmachines,fphotocopiers f f screenfprojectors f f autofpcs f f dongles f f set-topfbox ?f telecommunicationfproducts f fcellularfphones f fpagers ?f smallfindustrialfandfmedicalfinstrumentation f fgeneralfdatafcollectionfdevices f fpatientfandfpharmaceuticalfdatafcollection ffffffffff fdevices ?f irflans HSDL-3602 functional block diagram features ?f fullyfcompliantftofirdaf1.1fspecifcations: f f9.6fkb/sftof4fmb/sfoperation f fexcellentfnose-to-nosefoperation ?f typicalflinkfdistancef>f1.5fm ?f iec825-classf1feyefsafe ?f widefoperatingfvoltagefrangeff2.7fvftof3.6fv ?f smallfmodulefsizeff4.0fxf12.2fxf4.9fmmf(hfxfwfxfd) ?f completefshutdownfftxd,frxd,fpinfdiode ?f lowfshutdownfcurrentff10fnaftypical ?f adjustablefopticalfpowerfmanagementffadjust - ablefledfdrive-currentftofmaintainflinkfintegrity ?f singlefrxfdatafoutputfffirfselectfpinfswitchftoffir ?f integratedfemifshieldffexcellentfnoisefimmunity ?f edgefdetectionfinputffpreventsfthefledffromflongf turn-onftime ?f interfaceftofvariousfsuperfi/ofandfcontrollerfdevices ?f designedftofaccommodateflightflossfwithfcosmeticf window ?f onlyf2fexternalfcomponentsfarefrequired ?f leadffreefpackage txd (9) md0 (4) md1 (5) rxd (8) fir_sel (3) gnd (7) agnd (2) v cc (1) r1 v cc sp HSDL-3602 cx1 cx2 leda (10)
2 i/o pins confguration table pin description symbol f 1f supplyfvoltage f v cc f f 2f analogfground f agnd f f 3f firfselect f fir_self f 4f modef0 f md0 f 5f modef1 f md1f f 6f nofconnection f nc f 7f ground f gnd f 8f receiverfdatafoutput f rxd f 9f transmitterfdatafoutput f txd f 10f ledfanode f leda f thef HSDL-3602f canf bef completelyf shutf downf tof achievefveryflowfpowerfconsumption.finfthefshutfdownf mode,fthefpinfdiodefisfinactive,fthusfproducingfveryflit - tlefphoto-currentfevenfunderfveryfbrightfambientflight.f thef HSDL-3602f alsof incorporatesf thef capabilityf forf adjustablefopticalfpower.fwithftwofprogrammingfpins;f modef0fandfmodef1,fthefopticalfpowerfoutputfcanfbef adjustedflowerfwhenfthefnominalfdesiredflinkfdistancef isfone-thirdforftwo-thirdfofftheffullfirdaflink. thef HSDL-3602f comesf withf af frontf viewf packagingf optionf (HSDL-3602-007/-037)f andf af topf viewf packag - ingf optionf (HSDL-3602-008/-038).f itf hasf anf integratedf shieldfthatfhelpsftofensureflowfemifemissionfandfhighf immunityf tof emif feld,f thusf enhancingf reliablef perfor - mance. application support information thef applicationf engineeringf groupf inf avagof tech - nologiesf isf availablef tof assistf youf withf thef technicalf understandingf associatedf withf HSDL-3602f infraredf transceiverfmodule.fyoufcanfcontactfthemfthroughfyourf localf avagoftechnologies'f salesf representativesf forf ad - ditionalfdetails. back view (HSDL-3602-007/-037) bottom view (HSDL-3602-008/-038) ordering information package option package part number standard package increment f frontfview f HSDL-3602-007 f 400 f f f f frontfview f HSDL-3602-037 f 1800 f f f f topfview f HSDL-3602-008 f 400 f f f f f f f f f f f f f f f f f f f f topfview f HSDL-3602-038 f 1800 f f f f f f f f f f f f f f f f f f f f 8 7 6 5 4 3 2 1 9 10 back view (HSDL-3602 #007/#017) 8 7 6 5 4 3 2 1 9 10 bottom view (HSDL-3602-008/-038)
3 transceiver control truth table mode 0 mode 1 fir_sel rx function tx function f1f 0f xf shutdown f shutdown f0f 0f 0f sirf fullfdistancefpower f0f 1f 0f sirf 2/3fdistancefpower f1f 1f 0f sirf 1/3fdistancefpower f0f 0f 1f mir/firf fullfdistancefpower f0f 1f 1f mir/firf 2/3fdistancefpower f1f 1f 1f mir/firf 1/3fdistancefpower fxf=fdon'tfcare f recommended application circuit components component recommended value fr1f 2.2f?ff5%,f0.5fwatt,fforf2.7ffv cc ff3.3fvfoperation f ff 2.7f?ff5%,f0.5fwatt,fforf3.0ffv cc ff3.6fvfoperation fcx1 [5] f 0.47ffff20%,fx7rfceramic fcx2 [6] f 6.8ffff20%,ftantalum notes: 5.f cx1fmustfbefplacedfwithinf0.7fcmfoffthefHSDL-3602ftofobtainfoptimumfnoisefimmunity. 6.f inf"HSDL-3602ffunctionalfblockfdiagram"fonfpagef1fitfisfassumedfthatfvledfandfv cc fsharefthefsamefsupplyfvoltagefandfflterfcapacitors.finfcasef thef2fpinsfarefpoweredfbyfdiferentfsuppliesfcx2fisfapplicablefforfvledfandfcx1fforfv cc .finfenvironmentsfwithfnoisyfpowerfsupplies,fincludingf cx2fonfthefv cc flinefcanfenhancefsupplyfrejectionfperformance. f transceiver i/o truth table inputs outputs transceiver mode fir_sel txd ei led rxd factive f xf 1f xf onf notfvalid factive f 0f 0f high [1] f of f low [3] factive f 1f 0f high [2] f of f low [3] factive f xf 0f low f of f high fshutdown f xf x [4] f low f notfvalid f notfvalid xf=fdon'tfcarefffffeif=fin-bandfinfraredfintensityfatfdetector notes: 1.f in-bandfeiff115.2fkb/sfandffir_self=f0. 2.f in-bandfeiff0.576fmb/sfandffir_self=f1. 3.f logicflowfisfafpulsedfresponse.fthefconditionfisfmaintainedfforfdurationfdependentfonfthefpatternfandfstrengthfoffthefincidentfintensity. 4.f tofmaintainflowfshutdownfcurrent,ftxdfneedsftofbefdrivenfhighforflowfandfnotfleftffoating.
4 caution: the bicmos inherent to the design of this component increases the components susceptibility to damage from electrostatic discharge (esd). it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by esd. marking information thef HSDL-3602-007/-037f isf markedf 3602yywwf onf thefshieldfwherefyyfindicatesfthefunitsfmanufacturingf year,fandfwwfrefersftofthefworkfweekfinfwhichfthefunitf isftested. absolute maximum ratings [7] parameter symbol minimum maximum unit conditions storageftemperature f t s f C40f +100f ?c operatingftemperature f t a f C20f +70f ?c dcfledfcurrent f i ledf (dc) f f 165f ma peakfledfcurrent f i ledf (pk) f f 650f maf f90fsfpulsefwidth, f f f f f f f25%fdutyfcycle f f f 750f maf f2fsfpulsefwidth, f f f f f f f10%fdutyfcycle ledfanodefvoltage f v leda f C0.5f 7f v supplyfvoltage f v cc f 0f 7f v transmitterfdatafinputfcurrent f i txdf (dc) f C12f 12f ma receiverfdatafoutputfvoltage f v o f C0.5f v cc f+f0.5f vf |i o (rxd)|f=f20fa note: 7.f forfimplementationsfwherefcaseftofambientfthermalfresistanceff50?c/w. iled (a) 0.7 leda voltage (v) 0.3 HSDL-3602 graph 1 1.7 2.1 0 0.1 1.3 2.3 0.5 1.5 1.9 0.6 0.4 0.2 leda vs leda lop (mw/sr) 450 iled (a) 200 HSDL-3602 graph 2 0.3 0.6 0 50 0 0.7 350 0.1 0.4 400 300 100 250 150 0.2 0.5 light output power (lop) vs iled
5 recommended operating conditions parameter symbol minimum maximum unit conditions operatingftemperature f t a f C20f +70f ?c supplyfvoltage f v cc f 2.7f 3.6f v logicfhighfinputfvoltage f v ih f 2fv cc /3f v cc f v f forftxd,fmd0,fmd1,fand f fir_sel logicflowftransmitter f v il f 0f v cc /3f v f inputfvoltage ledf(logicfhigh)fcurrent f i leda f 400f 650f ma f pulsefamplitude receiverfsignalfrate f f 0.0024f 4f mb/s f electrical & optical specifcations f specifcationsfholdfoverfthefrecommendedfoperatingfconditionsfunlessfotherwisefnoted.funspecifedftestfcondi - tionsfcanfbefanywherefinftheirfoperatingfrange.fallftypicalfvaluesfarefatf25?cfandf3.3fvfunlessfotherwisefnoted. parameter symbol min. typ. max. units conditions transceiver supplyfcurrent f shutdown f i cc1 f f 10f 200f naf v sd ffv cc fCf0.5 f idlef i cc2 f f 2.5f 5f maf v i (txd)ffv il ,feif=f0 digitalfinput f logicf f i l /i h f C1 f f 1f af 0ffv i ffv cc f current f low/high transmitter transmitter f logicfhigh f ei h f 100f 250f 400f mw/srf v ih f=f3.0fv f radiant f intensity f f f f f f i leda f=f400fma f intensity f f f f f f f 1/2 ff15? f peakf f p f f 875 f f nm f f wavelength f spectralfline f ? 1/2 f f 35 f f nm f f halffwidth f viewingfangle f 2 1/2 f 30 f f 60 f f f opticalf tpwf(ei) f 1.5f 1.6f 1.8f sf tpw(txd)f=f1.6fsfatf115.2fkb/s f f pulsefwidth f f f f f f f f f 148f 217f 260f nsf tpw(txd)f=f217fnsfatf1.15fmb/s f f f 115f 125f 135f nsf tpw(txd)f=f125fnsfatf4.0fmb/s f risefand f t r f(ei), f f f 40f nsf tpw(txd)f=f125fnsfatf4.0fmb/s f f fallftimes f t f f(ei) f f f f f t r/f (txd)f=f10fns f maximum f tpwf(max) f f 20f 50f sf txdfpinfstuckfhigh f f optical f f pulsefwidth ledfanodefonfstatefvoltage f v on (leda) f f f 2.4f vf i leda f=f400fma,fv i (txd)ffv ih ledfanodefoffstatefleakage f i lk (leda) f f 1f 100f naf v leda f=fv cc f=f3.6fv, f current f f f f f f f v i (txd)ffv il ?
6 notes: 8.f anfin-bandfopticalfsignalfisfafpulse/sequencefwherefthefpeakfwavelength,fp,fisfdefnedfasf850ffpff900fnm,fandfthefpulsefcharacteristicsfaref compliantfwithfthefirdafserialfinfraredfphysicalflayerflinkfspecifcation. 9.f logicflowfisfafpulsedfresponse.fthefconditionfisfmaintainedfforfdurationfdependentfonfpatternfandfstrengthfoffthefincidentfintensity. 10.f forfin-bandfsignalsff115.2fkb/sfwheref3.6fw/cm 2 ffeiff500fmw/cm 2 . 11.f forfin-bandfsignalsfatf1.15fmb/sfwheref9.0fw/cm 2 ffeiff500fmw/cm 2 . 12.f forfin-bandfsignalsfoff125fnsfpulsefwidth,f4fmb/s,f4fppmfatfrecommendedf400fmafdrivefcurrent. 13.f pulsefwidthfspecifedfisfthefpulsefwidthfoffthefsecondf500fkhzfcarrierfpulsefreceivedfinfafdatafbit.ftheffrstf500fkhzfcarrierfpulsefmayfexceedf f 2fsfinfwidth,fwhichfwillfnotfafectfcorrectfdemodulationfoffthefdatafstream.fanfaskforfdaskfsystemfusingfthefHSDL-3602fhasfbeenfshownftof correctlyfreceivefallfdatafbitsfforf9fw/cm 2 ffeiff500fmw/cm 2 fincomingfsignalfstrength.faskforfdaskfshouldfuseftheffirfchannelfenabled. 14.f thefwakefupftimefisftheftimefbetweenftheftransitionffromfafshutdownfstateftofanfactivefstate,fandftheftimefwhenfthefreceiverfisfactivefandfreadyf tofreceivefinfraredfsignals. electrical & optical specifcations f specifcationsfholdfoverfthefrecommendedfoperatingfconditionsfunlessfotherwisefnoted.funspecifedftestfcondi - tionsfcanfbefanywherefinftheirfoperatingfrange.fallftypicalfvaluesfarefatf25?cfandf3.3fvfunlessfotherwisefnoted. parameter symbol min. typ. max. units conditions receiver receiverfdata f logicflow f v ol f 0f f 0.4f vf i ol f=f1.0fma, f outputfvoltage f f f f f f f eiff3.6fw/cm 2 , f f f f f f f f 1/2 ff15? f logicfhigh f v oh f v cc fCf0.2f f v cc f vf i oh f=fC20fa, f f f f f f f f eiff0.3fw/cm 2 , f f f f f f f f 1/2 ff15? f viewing f 2 1/2 f 30 f f f f f angle logicfhighfreceiverfinput f ei h f 0.0036 f f 500f mw/cm 2 f forfin-bandfsignals f irradiance f f f f f f f f115.2fkb/s [8] f f f f 0.0090 f f 500f mw/cm 2 f 0.576fmb/sffin-bandf f f f f f f f f signalsff4fmb/s [8] logicflowfreceiverfinput f ei l f f f 0.3f w/cm 2 f forfin-bandfsignals [8] f irradiance receiverfpeakfsensitivity f p f f 880 f f nm f wavelength receiverfsirfpulsefwidth f tpwf(sir) f 1 f f 4.0f sf 1/2 ff15? [10] ,fc l f=f10fpf receiverfmirfpulsefwidth f tpwf(mir) f 100 f f 500f nsf 1/2 ff15? [11] ,fc l f=f10fpf receiverffirfpulsefwidth f tpwf(fir) f 85 f f 165f nsf 1/2 ff15? [12] ,fc l f=f10fpf, f f f f f f f f v cc f=f3ftof3.6fv f f f f f 190f nsf 1/2 ff15? [12] ,fc l f=f10fpf, f f f f f f f f v cc f=f2.7fv receiverfaskfpulsefwidth f tpwf(ask) f f 1 f f sf 500fkhz/50%fdutyfcycle f f f f f f f f carrierfask [13] receiverflatencyftimefforffir f t lf (fir) f f 40f 50f s receiverflatencyftimefforfsir f t lf (sir) f f 20f 50f s receiverfrise/fallftimes f t r/f f(rxd) f f 25 f f ns receiverfwakefupftime f t w f f f 100f sf [14] ?
7 txd "stuck on" protection rxd output waveform led optical waveform receiver wake up time defnition (when md0 1 and md1 0) t pw (max.) txd led t f v oh 90% 50% 10% v ol t pw t r t f led off 90% 50% 10% led on t pw t r rx light t w rxd valid data
8 HSDL-3602-007 and HSDL-3602-037 package outline with dimension and recommended pc board pad layout pin 1 mounting center 6.10 4.18 4.00 12.20 3.84 r 1.77 r 2.00 4.05 4.95 10 castellation: pitch 1.1 0.1 cumulative 9.90 0.1 0.70 0.80 1.70 pin 10 0.45 1.20 0.80 2.55 1.90 3.24 1.90 4.98 mid of land 1.05 2.40 2.35 2.84 2.08 0.70 0.43 pin 10 pin 1 mounting center top view front view land pattern back view side view all dimensions in millimeters (mm) . dimension tolerance is 0.20 m m unless otherwise specified. 1.17 pin 1 pin 10
9 HSDL-3602-008 and HSDL-3602-038 package outline with dimension and recommended pc board pad layout 3.85 0.47 0.36 0.83 0.42 0.94 0.31 0.84 0.53 0.31 0.28 1.77 2.15 +0.05 - 0.00 12.2 +0.10 - 0.00 4.16 +0.05 - 0.00 11.7 +0.05 - 0.00 2.5 5 11.7 0.85 0.3 2.08 1.46 2.57 3.84 3.24 5 5 2.08 r2.3 r2.1 0.1 0.1 4.65 r2 r1.77 0.8 0.73 0.94 1.95
10 tape and reel dimensions (HSDL-3602-007, -037) all dimensions in millimeters (mm) r 1.00 2.00 0.50 label empty parts mounted leader empty (400 mm min. ) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 0.50 shape and dimensions of reels quantity = 400 pieces per reel (HSDL-3602-007) 1800 pieces per tape (HSDL-3602-037) 21.00 0.80 12.50 0.10 8.00 0.10 4.00 0.10 24.00 0.30 1.75 0.10 0.40 0.10 4.25 0.10 ?1.55 0.05 11.50 0.10 2.00 0.10 b b 5 (max.) 5 (max.) 5.20 0.10 a a section a-a section b- b 10 3.8 a a ?1.5 0.1 10 11 12 8 7 3 2 1 4 5 6 4.4 9 a a a
11 tape and reel dimensions (HSDL-3602-008, -038) all dimensions in millimeters (mm) r 1.00 2.00 0.50 label empty parts mounted leader empty (400 mm min. ) (40 mm min.) direction of pulling (40 mm min.) configuration of tape 13.00 0.50 shape and dimensions of reels quantity = 400 pieces per reel (HSDL-3602-008) 1800 pieces per tape (HSDL-3602-038) 21.00 0.80 bo w e t ko f b do p2 d1 po p1 5.4 0.15 symbol spec symbol spec ao 4.4 0.10 bo 12.50 0.10 ko 4.85 0.10 po 4.0 0.10 p1 8.0 0.10 p2 2.0 0.10 t 0.35 0.10 e 1.75 0.10 f 11.5 0.10 do 1.55 0.10 d1 1.5 0.10 w 24.0 0.3 10po 40.0 0.20 b 5 (max.) 5 (max.) a a section a-a notes: 1. i.d. sprocket hole pitch cumulative tolerance is 0.2 mm. 2. corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. ao and bo measured on a place 0.3 mm above the bottom of the pocket. 4. ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. section b-b 8 0.10 ao
12 moisture proof packaging allf HSDL-3602f optionsf aref shippedf inf moisturef prooff package.foncefopened,fmoisturefabsorptionfbegins. baking conditions iffthefpartsfarefnotfstoredfinfdryfconditions,ftheyfmustf befbakedfbeforefrefowftofpreventfdamageftofthefparts. package temp. time f infreels f f 60cf f f f48fhours f infbulk f f 100cf f f f4fhours ff f 125cf f f f2fhours ff f 150cf f f f1fhour bakingfshouldfbefdonefonlyfonce. recommended storage conditions f storage f f 10cftof30c f f temperature f f relative f f belowf60%frh f f humidity time from unsealing to soldering afterf removalf fromf thef bag,f thef partsf shouldf bef sol - deredf withinf 3f daysf iff storedf atf thef reco m mendedf storagef conditions.f iff timesf longerf thanf 72f hoursf aref needed,fthefpartsfmustfbefstoredfinfafdryfbox. units in a sealed moisture-proof package package is opened (unsealed) environment less than 30 c, and less than 60% rh package is opened less than 72 hours perform recommended baking conditions no baking is necessary yes no no yes
13 thef refowf proflef isf af straight-linef representationf off af nominalf temperaturef proflef forf af convectivef refowf solderf process.fthef temperaturef proflef isf dividedf intof fourf processf zones,f eachf withf diferentf ?t/?timef tem - peraturef changef rates.fthef ?t/?timef ratesf aref detailedf inftheffollowingftable.fftheftemperaturesfarefmeasuredf atfthefcomponentftofprintedfcircuitfboardfconnections. inf processf zonef p1,f thef pcf boardf andf HSDL-3602f cas - tellationf pinsf aref heatedf tof af temperaturef off 160cf tof activatef thef fuxf inf thef solderf paste.f thef temperaturef rampf upf rate,f r1,f isf limitedf tof 4cf perf secondf tof allowf forfevenfheatingfoffbothfthefpcfboardfandfHSDL-3602f castellations. processf zonef p2f shouldf bef off sufcientf timef durationf (60f tof 120f seconds)f tof dryf thef solderf paste.f thef tem - peraturefisfraisedftofaflevelfjustfbelowfthefliquidusfpointf offthefsolder,fusuallyf200cf(392f).f processfzonefp3fisfthefsolderfrefowfzone.finfzonefp3,fthef f temperaturef isf quicklyf raisedf abovef thef liquidusf pointf off solderf tof 255cf (491f)f forf optimumf results.f thef dwellf timef abovef thef liquidusf pointf off solderf shouldf maximum process zone symbol ?t ?t/?time heatfup f f p1,fr1f 25?cftof160?c f f f 4?c/s solderfpastefdry f f p2,fr2f 160?cftof200?c f f 0.5?c/s solderfrefow f f p3,fr3f 200?cftof255?c f f 4?c/s f f f f (260?cfatf10fsecondsfmax.) f f f p3,fr4f 255?cftof200?c f f C6?c/s coolfdown f f p4,fr5f 200?cftof25?c f f f C6?c/s recommended refow profle bef betweenf 20f andf 60f seconds.f itf usuallyf takesf aboutf 20f secondsf tof assuref properf coalescingf off thef solderf ballsfintofliquidfsolderfandfthefformationfoffgoodfsolderf connections.f beyondf af dwellf timef off 60f seconds,f thef intermetallicfgrowthfwithinfthefsolderfconnectionsfbe - comesfexcessive,fresultingfinfthefformationfoffweakfandf unreliablefconnections.ftheftemperaturefisfthenfrapidlyf f reducedf tof af pointf belowf thef solidusf temperaturef off thef solder,f usuallyf 200cf (392f),f tof allowf thef solderf withinfthefconnectionsftoffreezefsolid.f processfzonefp4fisfthefcoolfdownfafterfsolderffreeze.fthef coolfdownfrate,fr5,ffromfthefliquidusfpointfoffthefsolderf tof25cf(77f)fshouldfnotfexceedf6cfperfsecondfmaxi - mum.fthisflimitationfisfnecessaryftofallowfthefpcfboardf andf HSDL-3602f castellationsf tof changef dimensionsf evenly,fputtingfminimalfstressesfonfthefHSDL-3602f f transceiver. 0 t-time (seconds) t C temperature C ( c) 230 200 160 120 80 50 150 100 200 250 300 180 220 255 p1 heat up p2 solder paste dry p3 solder reflow p4 cool down 25 r1 r2 r3 r4 r5 60 sec. max. above 220 c max. 260 c
14 dim. mm inches fa f f 2.40 f f 0.095 fb f f 0.70 f f 0.028 fcf(pitch) f f 1.10 f f 0.043 fd f f 2.35 f f 0.093 fe f f 2.80 f f 0.110 fff f f 3.13 f f 0.123 fg f f 4.31 f f 0.170 ff appendix a: HSDL-3602-007/-037 smt assembly application note 1.0.fsolderfpad,fmask,fandfmetalfsolderfstencilfaperture figure 1. stencil and pcba. 1.1.frecommendedflandfpatternfforfHSDL-3602-007/-037 figure 2. top view of land pattern. HSDL-3602 fig 1.0 metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b theta 10x pad y d e g tx lens rx lens fiducial x c fiducial h f
15 ?f adjacentf landf keep-outf isf thef maximumf spacef oc - cupiedfbyfthefunitfrelativeftoftheflandfpattern.ftheref shouldf bef nof otherf smdf componentsf withinf thisf area.f ?f hfisfthefminimumfsolderfresistfstripfwidthfrequiredf tofavoidfsolderfbridgingfadjacentfpads. ?f itfisfrecommendedfthatf2ffducialfcrossfbefplacedfatf mid-lengthfoffthefpadsfforfunitfalignment. notef:fwet/liquidfphoto-imagineablefsolderfresist/maskf isfrecommended. 1.2. adjacent land keep-out and solder mask areas dim. mm inches fh f f min.f0.2ffffffffffffffffffmin.f0.008 fjf f f 13.4fffffffffffffffffffffffff0.528 fk f f 4.7ffffffffffffffffffffffffffff0.185 flf f f 3.2ffffffffffffffffffffffffffff0.126 f figure 3. HSDL-3602-007/-037 pcba-adjacent land keep-out and solder mask. h l rx lens tx lens dim . m m i nches h j k l min. 0.2 13.4 4.7 3.2 min. 0.008 0.528 0.185 0.126 j solder mask land k ? adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern . there should be no other sm d components within this area. ? "h" is the minimum solder resist strip width required to avoid solder bridging adjacent pads. ? it is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. y
16 figure 4. solder paste stencil aperture. see figure 4 t, nominal stencil thickness l, length of aperture mm inches mm inches ff 0.152f 0.006f f f 2.8ff0.05f 0.110ff0.002 ff 0.127f 0.005f f f 3.4ff0.05f 0.134ff0.002 fw,fthefwidthfoffaperturefisffxedfatf0.70fmmf(0.028finches) faperturefopeningfforfshieldfpadfisf2.8fmmfxf2.35fmmfasfperflandfdimension. f 2.0. recommended solder paste/cream volume for castel - lation joints basedf onf calculationf andf experiment,f thef printedf sol - derf pastef volumef requiredf perf castellationf padf isf 0.30f cubicfmmf(basedfonfeitherfno-cleanforfaqueousfsolderf creamf typesf withf typicallyf 60f tof 65%f solidf contentf byf volume). 2.1. recommended metal solder stencil aperture itfisfrecommendedfthatfonlyf0.152fmmf(0.006finches)forf 0.127fmmf(0.005finches)fthickfstencilfbefusedfforfsolderf pastefprinting.fthisfisftofensurefadequatefprintedfsolderf pastefvolumefandfnofshorting.ftheffollowingfcombina - tionf off metalf stencilf aperturef andf metalf stencilf thick - nessfshouldfbefused: 3.0. pick and place misalignment tolerance and product self-alignment after solder refow iff thef printedf solderf pastef volumef isf adequate,f thef unitfwillfself-alignfinfthefx-directionfafterfsolderfrefow.f unitsfshouldfbefproperlyfrefowedfinfirfhotfairfconvec - tionf ovenf usingf thef recommendedf refowf profle.f fthef directionfoffboardftravelfdoesfnotfmatter. allowable misalignment tolerance x-direction f f0.2fmmf(0.008finches) theta-direction f f2fdegrees f HSDL-3602 fig 4.0 aperture as per land solder paste l w t (stencil thickness)
17 3.1. tolerance for x-axis alignment of castellation misalignmentfoffcastellationftoftheflandfpadfshouldfnotfexceedf0.2fmmforfapproximatelyfhalffthefwidthfoffthefcas - tellationfduringfplacementfoffthefunit.fthefcastellationsfwillfcompletelyfself-alignftofthefpadsfduringfsolderfrefowfasf seenfinfthefpicturesfbelow. 3.2. tolerance for rotational (theta) misalignment unitsfwhenfmountedfshouldfnotfbefrotatedfmorefthanff2fdegreesfwithfreferenceftofcenterfx-yfasfspecifedfinffig - uref2.fpicturesf3fandf4fshowfunitsfbeforefandfafterfrefow.funitsfwithfafthetafmisalignmentfoffmorefthanf2fdegreesf dofnotfcompletelyfself-alignfafterfrefow.funitsfwithff2fdegreefrotationalforfthetafmisalignmentfself-alignedfcom - pletelyfafterfsolderfrefow. picture 1. castellation misaligned to land pads in x-axis before refow. picture 2. castellation self-align to land pads after refow. picture 3. unit is rotated before refow. picture 4. unit self-aligns after refow.
18 3.3. y-axis misalignment of castellation infthefy-direction,fthefunitfdoesfnotfself-alignfafterfsol - derf refow.f itf isf recommendedf thatf thef unitf bef placedf inflinefwithftheffducialfmarkf(mid-lengthfofflandfpad).f thisfwillfenablefsufcientflandflengthf(minimumfoff1/2f landflength)ftofformfafgoodfjoint.fseeffiguref5. 3.4. example of good HSDL-3602-007/-037 castellation solder joints thisf jointf isf formedf whenf thef printedf solderf pastef volumef isf adequate,f i.e.,f 0.30f cubicf mmf andf refowedf properly.fitfshouldfbefrefowedfinfirfhot-airfconvectionf refowfoven.fdirectionfoffboardftravelfdoesfnotfmatter. 4.0. solder volume evaluation and calculation geometeryfoffanfHSDL-3602-007/-037fsolderffllet. figure 5. section of a castellation in y-axis. picture 5. good solder joint. HSDL-3602 fig 5.0 minimum 1/2 the length of the land pad lens edge fiducial y 0.8 1.2 0.70 0.45 0.20 0.7 0.4
19 dim. mm inches fa f f 1.95 f f 0.077 fb f f 0.60 f f 0.024 fcf(pitch) f f 1.10 f f 0.043 fd f f 1.60 f f 0.063 fe f f 5.70 f f 0.224 fff f f 3.80 f f 0.123 fg f f 2.40 f f 0.170 ff appendix b: HSDL-3602-008/-038 smt assembly application note 1.0.fsolderfpad,fmask,fandfmetalfsolderfstencilfaperture figure 1. stencil and pcba. 1.1.frecommendedflandfpatternfforfHSDL-3602-008/-038 HSDL-3602 fig 1.0 metal stencil for solder paste printing land pattern pcba stencil aperture solder mask shield solder pad a b theta 10x pad y d e g tx lens rx lens fiducial x c fiducial h f
20 2.0 y-axis misalignment of castellation infthefy-direction,fthefunitfdoesfnotfself-alignfafterfsol - derf refow.f itf isf recommendedf thatf thef unitf bef placedf inflinefwithftheffducialfmarkf(mid-lengthfofflandfpad).f thisfwillfenablefsufcientflandflengthf(minimumfoff1/2f landflength)ftofformfafgoodfjoint.fseeffiguref2. figure 2. section of a castellation in y-axis. y 1/2 the length of the castella tion p ad fiducial
21 appendix c: general application guide for the HSDL-3602 infrared irda? compliant 4 mb/s transceiver description thef HSDL-3602f widef voltagef operatingf rangef infraredf transceiverf isf af low-costf andf smallf formf factorf thatf isf designedftofaddressfthefmobilefcomputingfmarketfsuchf asf notebooks,f printersf andf lanf accessf asf wellf asf smallf embeddedf mobilef productsf suchf asf digitalf cameras,f cellularf phones,f andf pdas.f itf isf fullyf compliantf tof irdaf 1.1f specifcationf upf tof 4f mb/s,f andf supportsf hp-sir,f sharpf ask,f andf tvf remotef modes.f thef designf off thef HSDL-3602falsofincludesftheffollowingfuniqueffeatures: ?f lowfpassivefcomponentfcount. ?f adjustablef opticalf powerf managementf (full,f 2/3,f 1/3f power). ?f shutdownfmodefforflowfpowerfconsumptionfrequire - ment. ?f single-receivefoutputfforfallfdatafrates. adjustable optical power management thef HSDL-3602f transmitterf ofersf user-adjustablef opti - calfpowerflevels.fthefusefofftwoflogic-levelfmode-selectf inputfpins,fmodef0fandfmodef1,fofersfshutdownfmodef asf wellf asf threef transmitf powerf levelsf asf shownf inf thef followingf table.f thef powerf levelsf aref setupf tof corre - spondfnominallyftofmaximum,ftwo-third,fandfone-thirdf offtheftransmissionfdistance.fthisfuniqueffeaturefallowsf lowerf opticalf powerf tof bef transmittedf atf shorterf linkf distancesftofreducefpowerfconsumption. therefaref2fbasicfmeansftofadjustfthefopticalfpowerfoff thefHSDL-3602: dynamic:f thisf implementationf enablesf thef transceiverf pairf tof adjustf theirf transmitterf powerf accordingf tof thef linkf distance.f however,f thisf requiresf thef irdaf protocolf stackf (mainlyf thef irlapf layer)f tof bef modifed.f pleasef contactfagilentfapplicationfgroupfforffurtherfdetails. static:f pre-programf thef romf biosf off thef systemf (e.g.f notebookf pc,f digitalf camera,f cellf phones,f orf pda)f tof allowf thef endf userf tof selectf thef desiredf opticalf powerf duringfthefsystemfsetupfstage. mode mode 1 transmitter 1f 0f shutdown 0f 0f fullfpower 0f 1f 2/3fpower 1f 1f 1/3fpower f f resistorfr1fshouldfbefselectedftofprovidefthefappropri - atefpeakfpulsefledfcurrentfoverfdiferentfrangesfoffvcc.f thefrecommendedfr1fforfthefvoltagefrangefoff2.7fvftof 3.3fvfisf2.2f?fwhilefforf3.0fvftof3.6fvfisf2.7f?.fthefhsdl- 3602f typicallyf providesf 250f mw/srf off intensityf atf thef recommendedfminimumfpeakfpulsefledfcurrentfoff400f ma. interface to recommended i/o chips thef HSDL-3602sf txdf dataf inputf isf buferedf tof allowf forfcmosfdriveflevels.fnofpeakingfcircuitforfcapacitorfisf required.f datafrateffromf9.6fkb/sfupftof4fmb/sfisfavailablefatfthef rxdf pin.f thef fir_self pinf selectsf thef dataf ratef thatf isf receivablefthroughfrxd.fdatafratesfupftof115.2fkb/sfcanf bef receivedf iff fir_self isf setf tof logicf low.f dataf ratesf upf tof4fmb/sfcanfbefreceivedfifffir_selfisfsetftoflogicfhigh.f softwaref driverf isf necessaryf tof programf thef fir_self tof lowforfhighfatfafgivenfdatafrate.f 4fmb/sfirflinkfdistancefoffgreaterfthanf1.5fmetersfhavef beenfdemonstratedfusingftypicalfHSDL-3602funitsfwithf nationalfsemiconductorsfpc87109f3 f vfendecfandfsuperf i/os,fandfthefsmcfsuperfi/ofchips. (a) national semiconductor super i/o and infrared controller forf nationalf semiconductorf superf i/of andf infraredf controllerf chips,f irf linkf canf bef realizedf withf thef followingfconnections:f ?f connectfirtxfoffthefnationalfsuperfi/oforfirfcontrol - lerftoftxdf(pinf9)foffthefHSDL-3602. ?f connectfirrx1foffthefnationalfsuperfi/oforfirfcontrol - lerftofrxdf(pinf8)foffthefHSDL-3602. ?f connectfirsl0foffthefnationalfsuperfi/oforfirfcontrol - lerftoffir_self(pinf3)foffthefHSDL-3602. pleasef referf tof thef tablef belowf forf thef irf pinf assign - mentsfforfthefnationalfsuperfi/ofandfirfcontrollersfthatf supportfirdaf1.1fupftof4fmb/s: selection of resistor r1
22 irtx irrx1 irsl0 fpc97/87338vjg f f 63f 65 f f f 66 fpc87308vul f f 81f 80 f f f 79 fpc87108avhg f f 39f 38 f f f 37 fpc87109vbe f f 15f 16 f f f 14 fpleasefreferftofthefnationalfsemiconductorfdatafsheetsfandfapplicationfnotesfforfupdatedfinformation. f (b) HSDL-3602 interoperability with national semiconduc - tor pc97338vjg sio evaluation r eport introduction thef objectivef off thisf reportf isf tof demonstratef thef in - teroperabilityf off thef HSDL-3602f irf transceiverf irf mod - ulefasfwirelessfcommunicationfportsfatfthefspeedfoff2.4f kb/sf -f 4f mb/sf withf nssf pc97338vjgf superf i/of underf typicalfoperatingfconditions. test procedures (1)f twof pc97338vjgf evaluationf boardsf weref con - nectedf tof thef isaf busf off twof pcsf (pentiumf 200f mhz)f runningf microsoftsf dosf operatingf system.f onef systemf withf anf HSDL-3602f irf transceiverf connectedf tof thef pc97338vjgf evaluationf boardf willfactfasfthefmasterfdevice.fanotherfsystemfwithf anf HSDL-3602f irf transceiverf connectedf tof thef pc97338vjgf willf actf asf thef slavef devicef (i.e.f de - vicefunderftest). (2)f theftestfsoftwarefusedfinfthisfinteroperabilityftestf isfprovidedfbyfnationalfsemiconductor.fafflefsizef off 1.7mf bytef fromf thef masterf device,f withf thef pc97338vjgf performingf thef framing,f encodingf isf transmittedf tof thef slavef device.fthef slavef device,f withf thef pc97338vjgf performingf thef decoding,f andfcrcfchecksum,fwillfreceiveftheffle.fthefflefisf thenfcheckedfforferrorfbyfcomparingfthefreceivedf flef withf thef originalf flef usingf thef dosffcf com - mand. (3)f theflinkfdistancefisfmeasuredfbyfadjustingfthefdis - tancef betweenf thef masterf andf slavef forf errorlessf datafcommunications. txd (9) md0 (4) md1 (5) rxd (8) fir_sel (3) gnd (7) agnd (2) v cc (1) leda (10) r1 v cc sp HSDL-3602 cx1 cx2 national semiconductor super i/o or ir controller irtx irrx1 irsl0 HSDL-3602 functional diagram (a) * * * mode ground for full power operation hsdl-3600 functional block diagram
23 HSDL-3602 interoperability with ns pc97338 report (i) test conditions v cc f=f3.0fCf3.6fv rledf=f2.7f? opticalftransmitterfpulsefwidthf=f125fns modefsetftoffullfpower (ii) test result thefinteroperabilityftestfresultsfshowfthatfHSDL-3602firf transceiverf canf operatef f 1.5f meterf linkf distancef fromf 3fvftof3.6fvfwithfnssfpc97338fatfanyfirdaf1.1fdatafratef withoutferror. (c) standard micro system corporation (smc) super and ultra i/o controllers forfsmcfsuperfandfultrafi/ofcontrollerfchips,firflinkfcanf befrealizedfwithftheffollowingfconnections:f ?f connectfirtxfoffthefsmcfsuperforfultrafi/ofcontrollerf toftxdf(pinf9)foffthefHSDL-3602. ?f connectfirrxfoffthefsmcfsuperforfultrafi/ofcontrollerf tofrxdf(pinf8)foffthefHSDL-3602. ?f connectfirmodefoffthefsuperforfultrafi/ofcontrollerf toffir_self(pinf3)foffthefHSDL-3602. pleasef referf tof thef tablef belowf forf thef irf pinf assign - mentsf forf thef smcf superf orf ultraf i/of controllersf thatf supportfirdaf1.1fupftof4mb/s: HSDL-3602 interoperability with smc 669/769 report (i) test conditions vccf=f3.0fCf3.6fv rledf=f2.2f? opticalftransmitterfpulsefwidthf=f125fns modefsetftoffullfpower (ii) test result thefinteroperabilityftestfresultsfshowfthatfHSDL-3602firf f transceiverf canf operatef f 1.5f meterf linkf distancef fromf 3fvftof3.6fvfwithfsmcf669/769fatfanyfirdaf1.1fdatafratef withoutferror. txd (9) md0 (4) md1 (5) rxd (8) fir_sel (3) gnd (7) agnd (2) v cc (1) leda (10) r1 v cc sp HSDL-3602 cx1 cx2 national semiconductor pc97338vjg super i/o irtx (63) irrx1 (65) irsl0 (66 ) HSDL-3602 functional diagram (b) * * * mode ground for full power operation a0 - a3 rd, wr, cs d0 - d7 drq dack, tc irq system bus HSDL-3602 functional block diagram 14.314 mhz clock
24 HSDL-3602 interoperability with smc's super i/o or ir controller irtx irrx irmode ffdc37c669fr f f 89f 88 f f f 23 ffdc37n769 f f 87f 86 f f f 21 ffdc37c957/8fr f f 204f 203 f f f 145forf190 f txd (9) md0 md1 rxd (8) fir_sel (3) gnd (7) agnd (2) v cc (1) leda (10) r1 v cc sp HSDL-3602 cx1 cx2 4 5 standard microsystem corporation super i/o or ir controller irrx irmode irtx mode ground for full power operation
25 tof ensuref irdaf compliance,f somef constraintsf onf thef heightf andf widthf off thef windowf exist.f thef minimumf dimensionsf ensuref thatf thef irdaf conef anglesf aref metf withoutf vignetting.f thef maximumf dimensionsf mini - mizef thef efectsf off strayf light.f thef minimumf sizef cor - respondsftofafconefanglefoff30 0 fandfthefmaximumfsizef correspondsftofafconefanglefoff60 o . inf thef fguref below,f xf isf thef widthf off thef window,fyf isf thef heightf off thef windowf andf zf isf thef distancef fromf thefHSDL-3602ftofthefbackfoffthefwindow.fthefdistancef fromf thef centerf off thef ledf lensf tof thef centerf off thef photodiodeflens,fk,fisf7.08mm.fthefequationsfforfcom - putingfthefwindowfdimensionsfarefasffollows: xf=fkf+f2*(z+d)*tana f yf=f2*(z+d)*tana thef abovef equationsf assumef thatf thef thicknessf off thef windowf isf negligiblef comparedf tof thef distancef off thef modulef fromf thef backf off thef windowf (z).f iff theyf aref comparable,f z'f replacesf zf inf thef abovef equation.f f z'f isf defnedfas f z'=z+t/n whereftfisfthefthicknessfoffthefwindowfandfnfisfthefre - fractivefindexfoffthefwindowfmaterial. appendix d: optical port dimensions for HSDL-3602: section of a castellation in y-axis. d z k a ir transparent window opaque material opaque material ir transparent window HSDL-3602 optical port dimensions x
26 aperture width aperture height (x, mm) (y, mm) module depth, (z) mm max. min. max. min. f 0f f 16.318f 11.367 f ff 9.238 f f 4.287 f 1f f 17.472f 11.903 f ff 10.392 f f 4.823 f 2f f 18.627f 12.439 f ff 11.547 f f 5.359 f 3f f 19.782f 12.975 f ff 12.702 f f 5.895 f 4f f 20.936f 13.511 f ff 13.856 f f 6.431 f 5f f 22.091f 14.047 f ff 15.011 f f 6.967 f 6f f 23.246f 14.583 f ff 16.166 f f 7.503 f 7f f 24.401f 15.118 f ff 17.321 f f 8.038 f 8f f 25.555f 15.654 f ff 18.475 f f 8.574 f 9f f 26.710f 16.190 f ff 19.630 f f 9.110 thefdepthfoffthefledfimagefinsidefthefHSDL-3602,fd,fisf 8mm.fafisfthefrequiredfhalffanglefforfviewing.fforfirdaf compliance,f thef minimumf isf 15 0 f andf thef maximumf isf 30 0 .fassumingfthefthicknessfoffthefwindowftofbefneg - ligible,fthefequationsfresultfinftheffollowingftablesfandf graphs: aperture width (x) C mm 30 module depth (z) C mm 10 HSDL-3602 width vs depth 4 7 0 5 0 9 15 2 6 20 x max. x min. 25 1 3 5 8 aperture width (x) vs module depth aperture height (y) C mm module depth (z) C mm 10 HSDL-3602 height vs dept h 4 7 0 5 0 9 15 2 6 20 y max. y min. 25 1 3 5 8 aperture height (y) vs module depth
27 window material almostfanyfplasticfmaterialfwillfworkfasfafwindowfmate - rial.fpolycarbonatefisfrecommended.fthefsurfaceffnishf off thef plasticf shouldf bef smooth,f withoutf anyf texture.f anfirfflterfdyefmayfbefusedfinfthefwindowftofmakefitf lookf blackf tof thef eye,f butf thef totalf opticalf lossf off thef windowf shouldf bef 10f percentf orf lessf forf bestf opticalf performance.flightflossfshouldfbefmeasuredfatf875fnm. shape of the window fromfanfopticsfstandpoint,fthefwindowfshouldfbeffat.f thisf ensuresf thatf thef windowf willf notf alterf eitherf thef radiationf patternf off thef led,f orf thef receivef patternf off thefphotodiode. flat window (first choice) iff thef windowf mustf bef curvedf forf mechanicalf orf in - dustrialf designf reasons,f placef thef samef curvef onf thef backfsidefoffthefwindowfthatfhasfanfidenticalfradiusfasf thef frontf side.fwhilef thisf willf notf completelyf eliminatef thef lensf efectf off thef frontf curvedf surface,f itf willf sig - nifcantlyf reducef thef efects.fthef amountf off changef inf thef radiationf patternf isf dependentf uponf thef materialf chosenfforfthefwindow,fthefradiusfofftheffrontfandfbackf curves,f andf thef distancef fromf thef backf surfacef tof thef transceiver.foncefthesefitemsfarefknown,faflensfdesignf canfbefmadefwhichfwillfeliminatefthefefectfofftheffrontf surfacefcurve. thef followingf drawingsf showf thef efectsf off af curvedf windowfonfthefradiationfpattern.ffinfallfcases,fthefcenterf thicknessfoffthefwindowfisf1.5fmm,fthefwindowfisfmadef off polycarbonatef plastic,f andf thef distancef fromf thef transceiverftofthefbackfsurfacefoffthefwindowfisf3fmm. HSDL-3602 flat window curved front and back (second choice) HSDL-3602 curved window curved front, flat back (do not use) HSDL-3602 curved/flat window for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. 5988-9347en - may 30, 2006

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